Resist underlayer film-forming composition containing substituted crosslinkable compound

ABSTRACT

A resist underlayer film for use in lithography process which generates less sublimate, has excellent embeddability at the time of applying onto a substrate having a hole pattern, and has high dry etching resistance, wiggling resistance and heat resistance, etc. A resist underlayer film-forming composition including a resin and a crosslinkable compound of Formula (1) or Formula (2): 
                         
in which Q 1  is a single bond or an m1-valent organic group, R 1  and R 4  are each a C 2-10  alkyl group or a C 2-10  alkyl group having a C 1-10  alkoxy group, R 2  and R 5  are each a hydrogen atom or a methyl group, R 3  and R 6  are each a C 1-10  alkyl group or a C 6-40  aryl group.

TECHNICAL FIELD

The present invention relates to a crosslinking catalyst for a resistunderlayer film-forming composition for lithography that is effective atthe time of semiconductor substrate processing, a resist underlayerfilm-forming composition containing the crosslinking catalyst, a methodfor forming a resist pattern using the resist underlayer film formingcomposition, and a method for producing a semiconductor device.

BACKGROUND ART

Conventionally, microfabrication has been carried out by lithographyusing a photoresist composition in the production of semiconductordevices. The microfabrication is a processing method including forming athin film of a photoresist composition on a to-be-processed substratesuch as a silicon wafer, irradiating the thin film with active lightsuch as ultraviolet rays through a mask pattern in which a pattern of asemiconductor device is depicted, developing the pattern, and etchingthe to-be-processed substrate such as a silicon wafer by using theobtained photoresist pattern as a protection film. In recent years,however, semiconductor devices have been further integrated, and theactive light to be used has had a shorter wavelength from a KrF excimerlaser (248 nm) to an ArF excimer laser (193 nm). This raises seriousproblems of the effects of diffused reflection of active light from thesubstrate and standing wave. Consequently, a method has been widelyapplied in which a resist underlayer film called a bottomanti-reflective coating (BARC) is provided between a photoresist and ato-be-processed substrate.

In order to achieve further microfabrication, a lithography techniqueusing extreme ultraviolet rays (EUV, wavelength 13.5 nm) and electronbeams (EB) as the active light has been developed. In the EUVlithography or the EB lithography, a specific anti-reflective coating isnot required because the diffused reflection from the substrate and thestanding wave are not usually generated. The resist underlayer film,however, has begun to be widely studied as an auxiliary film forimproving the resolution of a resist pattern and adhesion.

The resist underlayer film formed between the photoresist and theprocessed substrate is generally formed as a thermally curablecrosslinking film that does not generate mixing with the resist througha baking process after the application of the resist underlayerfilm-forming composition onto the processed substrate in order to reducemixing with the resist stacked on the upper layer.

Usually, a crosslinkable compound (a crosslinking agent) and a catalyst(a crosslinking catalyst) for promoting the crosslinking reaction areadded to the resist underlayer film-forming composition in addition to apolymer resin being a main component in order to form such a thermallycurable film. In particular, a thermal acid generator such as a sulfonicacid compound, a carboxylic acid compound, and a sulfonic acid ester ismainly used as the crosslinking catalyst.

In recent years, generation of a sublimation component (sublimate)derived from the polymer resin and low molecular weight compounds suchas the crosslinking agent and the crosslinking catalyst at the time ofbaking when the resist underlayer film is formed by using the resistunderlayer film-forming composition in the lithography process ofsemiconductor device production has been a new problem. Such sublimatecontaminates the inside of film formation apparatus by attaching andaccumulating the sublimate in the film formation apparatus during thesemiconductor device production process. These contaminations may be ageneration factor of defects and the like by attaching thesecontaminations onto wafers as foreign substances. Consequently, a newunderlayer film-forming composition that can reduce the sublimategenerated from the resist underlayer film as low as possible is requiredto be developed. A resist underlayer film showing a low sublimategeneration property has been also studied (refer to, for example, PatentDocument 1 and Patent Document 2).

In order to achieve excellent embeddability and reduce a sublimateamount, a technique of using a crosslinking agent having an N atom in aglycol urea-based compound and a melamine-based compound having a butylether group has been disclosed (refer to Patent Document 3).

In addition, a compound having hydroxymethyl group, methoxymethyl group,ethoxymethyl group, methoxypropoxymethyl group, or the like at the sidechain has been disclosed (refer to Patent Document 4 and Patent Document5).

PRIOR ART DOCUMENTS Patent Documents

Patent Document 1: Japanese Patent Application Publication No.2009-175436 (JP 2009-175436 A)

Patent Document 2: Japanese Patent Application Publication No.2010-237491 (JP 2010-237491 A)

Patent Document 3: International Publication No, 2008/143302 Pamphlet(WO 2008/143302)

Patent Document 4: Japanese Patent Application Publication No.H11-160860 (JP H11-160860 A)

Patent Document 5: Japanese Patent Application Publication No.2003-122006 (JP 2003-122006 A)

SUMMARY OF THE INVENTION Problem to be Solved by the Invention

An object of the present invention is to provide a resist underlayerfilm-forming composition for use in a lithography process for asemiconductor device production.

The present invention provides a resist underlayer film-formingcomposition generating less sublimate and having excellent embeddabilityat the time of applying the composition onto a substrate having a holepattern.

Means for Solving the Problem

The present invention provides, as a first aspect, a resist underlayerfilm-forming composition comprising a resin and a crosslinkable compoundof Formula (1) or Formula (2):

(where Q¹ is a single bond or an m1-valent organic group; R¹ and R⁴ areeach a C₂₋₁₀ alkyl group or a C₂₋₁₀ alkyl group having a C₁₋₁₀ alkoxygroup; R² and R⁵ are each a hydrogen atom or a methyl group; R³ and R⁶are each a C₁₋₁₀ alkyl group or a C₆₋₄₀ aryl group;

n1 is an integer of 1≤n1≤3; n2 is an integer of 2≤n2≤5; n3 is an integerof 0≤n3≤3; n4 is an integer of 0≤n4≤3; a total of the integers is aninteger of 3≤(n1+n2+n3+n4)≤6;

n5 is an integer of 1≤n5≤3; n6 is an integer of 1≤n6≤4; n7 is an integerof 0≤n7≤3; n8 is an integer of 0≤n8≤3; a total of the integers is aninteger of 2≤(n5+n6+n7+n8)≤5; and m1 is an integer of 2 to 10),

as a second aspect, the resist underlayer film-forming compositionaccording to the first aspect, in which Q¹ is a single bond or anm1-valent organic group selected from a C₁₋₁₀ chain hydrocarbon group, aC₆₋₄₀ aromatic group, or combination thereof,

as a third aspect, the resist underlayer film-forming compositionaccording to the first aspect or the second aspect, in which thecrosslinkable compound of Formula (1) or Formula (2) is a compoundobtained by reacting a compound of Formula (3) or Formula (4):

(where Q² is a single bond or an m2-valent organic group; R⁸, R⁹, R¹¹,and R¹² are each a hydrogen atom or a methyl group; R⁷ and R¹⁰ are eacha C₁₋₁₀ alkyl group or a C₆₋₄₀ aryl group;

n9 is an integer of 1≤n9≤3; n10 is an integer of 2≤n10≤5; n11 is aninteger of 0≤n11≤3; n12 is an integer of 0≤n12≤3; a total of theintegers is an integer of 3≤(n9+n10+n11+n12)≤6;

n13 is an integer of 1≤n13≤3; n14 is an integer of 1≤n14≤4; n15 is aninteger of 0≤n15≤3; n16 is an integer of 0≤n16≤3; a total of theintegers is an integer of 2≤(n13+n14+n15+n16)≤5; and m2 is an integer of2 to 10) with an ether compound containing a hydroxy group or a C₂₋₁₀alcohol,

as a fourth aspect, the resist underlayer film-forming compositionaccording to the third aspect, in which the reaction of the compound ofFormula (3) or Formula (4) with the ether compound containing a hydroxygroup or the C₂₋₁₀ alcohol is carried out in the presence of an acidcatalyst,

as a fifth aspect, the resist underlayer film-forming compositionaccording to the fourth aspect, in which the acid catalyst is anion-exchange resin,

as a sixth aspect, the resist underlayer film-forming compositionaccording to any one of the third aspect to the fifth aspect, in whichthe ether compound containing a hydroxy group is propylene glycolmonomethyl ether or propylene glycol monoethyl ether,

as a seventh aspect, the resist underlayer film-forming compositionaccording to any one of the third aspect to the fifth aspect, in whichthe C₂₋₁₀ alcohol is ethanol, 1-propanol, 2-methyl-1-propanol, butanol,2-methoxyethanol, or 2-ethoxyethanol,

as an eighth aspect, the resist underlayer film-forming compositionaccording to any one of the first aspect to the seventh aspect, in whichthe resin is a novolac resin,

as a ninth aspect, the resist underlayer film-forming compositionaccording to any one of the first aspect to the eighth aspect, furthercomprising a crosslinking agent,

as a tenth aspect, the resist underlayer film-forming compositionaccording to any one of the first aspect to the ninth aspect, furthercomprising an acid and/or an acid generator,

as an eleventh aspect, a resist underlayer film obtained by applying theresist underlayer film-forming composition as described in any one ofthe first aspect to the tenth aspect onto a semiconductor substrate andbaking the applied resist underlayer film-forming composition,

as a twelfth aspect, a method for forming a resist pattern for use insemiconductor production, the method comprising: applying the resistunderlayer film-forming composition as described in any one of the firstaspect to the tenth aspect onto a semiconductor substrate, and bakingthe applied resist underlayer film forming composition to form a resistunderlayer film,

as a thirteenth aspect, a method for producing a semiconductor device,the method comprising: forming a resist underlayer film by using theresist underlayer film-forming composition as described in any one ofthe first aspect to the tenth aspect onto a semiconductor substrate;forming a resist film on the resist underlayer film; forming a resistpattern by irradiation with light or electron beams and development;etching the resist underlayer film by using the formed resist pattern;and processing the semiconductor substrate by using the patterned resistunderlayer film,

as a fourteenth aspect, a method for producing a semiconductor device,the method comprising: forming a resist underlayer film by using theresist underlayer film-forming composition as described in any one ofthe first aspect to the tenth aspect onto a semiconductor substrate;forming a hard mask on the resist underlayer film; forming a resist filmon the hard mask; forming a resist pattern by irradiation with light orelectron beams and development; etching the hard mask by using theformed resist pattern; etching the resist underlayer film by using thepatterned hard mask; and processing the semiconductor substrate by usingthe patterned resist underlayer film,

as a fifteenth aspect, the method according to the fourteenth aspect, inwhich the hard mask is formed by application of an inorganic substanceor vapor-deposition of an inorganic substance, and

as a sixteenth aspect, a compound of Formula (5):

(where Q³ is an isopropylidene group; R¹⁴ is a C₂₋₁₀ alkyl group or aC₂₋₁₀ alkyl group having a C₁₋₁₀ alkoxy group; R¹⁵ is a hydrogen atom ora methyl group; R¹³ is a C₁₋₁₀ alkyl group or a C₆₋₄₀ aryl group;

n17 is an integer of 1≤n17≤3; n18 is an integer of 1≤n18≤4; n19 is aninteger of 0≤n19≤3; n20 is an integer of 0≤n20≤3; and a total of theintegers is an integer of 2≤(n17+n18+n19+n20)≤5).

Effects of the Invention

The crosslinkable compound used in the present invention is acrosslinkable compound obtained by substituting a C₂₋₁₀ long chain alkylgroup or a C₂₋₁₀ alkyl group having a C₁₋₁₀ alkoxy group for an alkylgroup part (for example, a low molecular weight alkyl group such asmethyl group) in an alkoxy methyl group.

At the time of bonding the substituted crosslinkable compound with aresin to form a crosslink structure, an eliminated component eliminatedfrom the crosslinkable compound is a compound having a large molecularweight corresponding to the alkyl group part. Consequently, it isconsidered that the components to be sublimated can be reduced when theresist underlayer film-forming composition containing the crosslinkablecompound of the present invention was applied onto a substrate and theapplied compound was heated. As described above, the sublimate attachesin the chamber and the attached sublimate is dropped onto the substrateto cause coating defects.

Consequently, the composition of the present invention in which thesubstituted crosslinkable compound is used allows the coating defects tobe reduced.

The crosslinking reaction of the crosslinkable compound obtained bysubstituting the C₂₋₁₀ long chain alkyl group or the C₂₋₁₀ alkyl grouphaving the C alkoxy group for the alkyl group part (for example, a lowmolecular weight alkyl group such as methyl group) in the alkoxy methylgroup with the resin is moderately progressed. Consequently, after afine hole pattern is covered with the resist underlayer film-formingcomposition containing the crosslinkable compound of the presentinvention, reduction in flowability associated with forming athree-dimensional structure caused by crosslink does not occur for sometime. Consequently, use of the composition of the present inventionallows the hole pattern to be filled with the resist underlayerfilm-forming composition without clearance gaps.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an NMR spectrum of the tetra-substituted compound ofTBOM-BP-BU obtained in Synthesis Example 3.

FIG. 2 is an NMR spectrum of the tetra-substituted compound ofTBOM-BIP-A obtained in Synthesis Example 4,

FIG. 3 is an NMR spectrum of the tetra-substituted compound ofTPOM-BIP-A obtained in Synthesis Example 5.

FIG. 4 is an NMR spectrum of the tetra-substituted compound ofTEOM-BIP-A obtained in Synthesis Example 6,

FIG. 5 is an NMR spectrum of the tetra-substituted compound ofTIBOM-BIP-A obtained in Synthesis Example 7.

FIG. 6 is an NMR spectrum of the tetra-substituted compound ofEGME-BIP-A obtained in Synthesis Example 8.

FIG. 7 is an NMR spectrum of the tetra-substituted compound ofEGEE-BIP-A obtained in Synthesis Example 9.

FIG. 8 is an NMR spectrum of the tetra-substituted compound ofPGME-BIP-A obtained in Synthesis Example 10.

FIG. 9 is an NMR spectrum of the tetra-substituted compound ofEGIPE-BIP-A obtained in Synthesis Example 11,

MODES FOR CARRYING OUT THE INVENTION

The present invention relates to a resist underlayer film-formingcomposition containing a resin and a crosslinkable compound of Formula(1) and Formula (2).

The resist underlayer film-forming composition in the present inventionusually contains a resin, a crosslinkable compound of Formula (1) orFormula (2), and a solvent. The resist underlayer film-formingcomposition may further contain additives such as an acid generator anda surfactant if necessary. The solid content in the composition is 0.1%by mass to 70% by mass or 0.1% by mass to 60% by mass. The solid contentis a content ratio of the whole components of the resist underlayerfilm-forming composition from which the solvent is removed. In the solidcontent, the resin (polymer) can be contained in a ratio of 1% by massto 99.9% by mass, 50% by mass to 99.9% by mass, 50% by mass to 95% bymass, or 50% by mass to 90% by mass.

In the solid content, the crosslinkable compound of Formula (1) orFormula (2) can be contained in a ratio of 0.01% by mass to 50% by mass,0.01% by mass to 40% by mass, or 0.1% by mass to 30% by mass.

The polymer used in the present invention has a weight average molecularweight of 600 to 1,000,000 or 600 to 200,000.

In the crosslinkable compound of Formula (1) or Formula (2) used in thepresent invention, Q¹ is a single bond or an m1-valent organic group; R¹and R⁴ are each a C₂₋₁₀ alkyl group or a C₂₋₁₀ alkyl group having aC₁₋₁₀ alkoxy group; R² and R⁵ are each a hydrogen atom or a methylgroup; R³ and R⁶ are each a C₁₋₁₀ alkyl group or a C₆₋₄₀ aryl group.

n1 is an integer of 1≤n1≤3; n2 is an integer of 2≤n2≤5; n3 is an integerof 0≤n3≤3; n4 is an integer of 0≤n4≤3; and a total of the integers is aninteger of 3≤(n1+n2+n3+n4)≤6.

n5 is an integer of 1≤n5≤3; n6 is an integer of 1≤n6≤4; n7 is an integerof 0≤n7≤3; n8 is an integer of 0≤n8≤3; and a total of the integers is aninteger of 2≤(n5+n6+n7+n8)≤5. m1 is an integer of 2 to 10.

Q¹ is a single bond or an m1-valent organic group selected from a C₁₋₁₀chain hydrocarbon group, a C₆₋₄₀ aromatic group, or a combinationthereof. The chain hydrocarbon group may include the following alkylgroups. The aromatic group may include the following aryl groups.

Examples of the C₂₋₁₀ alkyl group may include ethyl group, n-propylgroup, i-propyl group, cyclopropyl group, n-butyl group, i-butyl group,s-butyl group, t-butyl group, cyclobutyl group, 1-methyl-cyclopropylgroup, 2-methyl-cyclopropyl group, n-pentyl group, 1-methyl-n-butylgroup, 2-methyl-n-butyl group, 3-methyl-n-butyl group,1,1-dimethyl-n-propyl group, 1,2-dimethyl-n-propyl group,2,2-dimethyl-n-propyl group, 1-ethyl-n-propyl group, cyclopentyl group,1-methyl-cyclobutyl group, 2-methyl-cyclobutyl group,3-methyl-cyclobutyl group, 1,2-dimethyl-cyclopropyl group,2,3-dimethyl-cyclopropyl group, 1-ethyl-cyclopropyl group,2-ethyl-cyclopropyl group, n-hexyl group, 1-methyl-n-pentyl group,2-methyl-n-pentyl group, 3-methyl-n-pentyl group, 4-methyl-n-pentylgroup, 1,1-dimethyl-n-butyl group, 1,2-dimethyl-n-butyl group,1,3-dimethyl-n-butyl group, 2,2-dimethyl-n-butyl group,2,3-dimethyl-n-butyl group, 3,3-dimethyl-n-butyl group, 1-ethyl-n-butylgroup, 2-ethyl-n-butyl group, 1,1,2-trimethyl-n-propyl group,1,2,2-trimethyl-n-propyl group, 1-ethyl-1-methyl-n-propyl group,1-ethyl-2-methyl-n-propyl group, cyclohexyl group, 1-methyl-cyclopentylgroup, 2-methyl-cyclopentyl group, 3-methyl-cyclopentyl group,1-ethyl-cyclobutyl group, 2-ethyl-cyclobutyl group, 3-ethyl-cyclobutylgroup, 1,2-dimethyl-cyclobutyl group, 1,3-dimethyl-cyclobutyl group,2,2-dimethyl-cyclobutyl group, 2,3-dimethyl-cyclobutyl group,2,4-dimethyl-cyclobutyl group, 3,3-dimethyl-cyclobutyl group,1-n-propyl-cyclopropyl group, 2-n-propyl-cyclopropyl group,1-i-propyl-cyclopropyl group, 2-i-propyl-cyclopropyl group,1,2,2-trimethyl-cyclopropyl group, 1,2,3-trimethyl-cyclopropyl group,2,2,3-trimethyl-cyclopropyl group, 1-ethyl-2-methyl-cyclopropyl group,2-ethyl-1-methyl-cyclopropyl group, 2-ethyl-2-methyl-cyclopropyl group,and 2-ethyl-3-methyl-cyclopropyl group.

The C₁₋₁₀ alkyl group may include methyl group in addition to the C₂₋₁₀alkyl group.

Examples of the C₁₋₁₀ alkoxy group may include methoxy group, ethoxygroup, n-propoxy group, i-propoxy group, n-butoxy group, i-butoxy group,s-butoxy group, t-butoxy group, n-pentoxy group, 1-methyl-n-butoxygroup, 2-methyl-n-butoxy group, 3-methyl-n-butoxy group,1,1-dimethyl-n-propoxy group, 1,2-dimethyl-n-propoxy group,2,2-dimethyl-n-propoxy group, 1-ethyl-n-propoxy group, n-hexyloxy group,1-methyl-n-pentyloxy group, 2-methyl-n-pentyloxy group,3-methyl-n-pentyloxy group, 4-methyl-n-pentyloxy group,1,1-dimethyl-n-butoxy group, 1,2-dimethyl-n-butoxy group,1,3-dimethyl-n-butoxy group, 2,2-dimethyl-n-butoxy group, 2,3-dimethyln-butoxy group, 3,3-dimethyl-n-butoxy group, 1-ethyl-n-butoxy group,2-ethyl-n-butoxy group, 1,1,2-trimethyl-n-propoxy group,1,2,2-trimethyl-n-propoxy group, 1-ethyl-1-methyl-n-propoxy group, and1-ethyl-2-methyl-n-propoxy group.

Examples of the C₆₋₄₀ aryl group may include phenyl group, naphthylgroup, and anthryl group.

The crosslinkable compound of Formula (1) or Formula (2) can be obtainedby reacting a compound of Formula (3) or Formula (4) with an ethercompound containing a hydroxy group or a C₂₋₁₀ alcohol.

A compound of Formula (1) or Formula (2) formed by substituting theether compound containing a hydroxy group or the C₂₋₁₀ alcohol for 1 molof the compound of Formula (3) or Formula (4) in a ratio of 1 mol isdetermined as a mono-substituted compound. Similarly, a compound ofFormula (1) or Formula (2) formed by substituting the ether compoundcontaining a hydroxy group or the C₂₋₁₀ alcohol in a ratio of 2 mol isdetermined as a di-substituted compound. Similarly, a compound ofFormula (1) or Formula (2) formed by substituting the ether compoundcontaining a hydroxy group or the C₂₋₁₀ alcohol in a ratio of 3 mol isdetermined as a tri-substituted compound. Similarly, a compound ofFormula (1) or Formula (2) formed by substituting the ether compoundcontaining a hydroxy group or the C₂₋₁₀ alcohol in a ratio of 4 mol isdetermined as a tetra-substituted compound.

In Formula (3) and Formula (4), Q² is a single bond or an m2-valentorganic group. More specifically, Q² can be the single bond or them2-valent organic group selected from a C₁₋₁₀ chain hydrocarbon group, aC₆₋₄₀ aromatic group, or a combination thereof. Here, examples of thechain hydrocarbon group may include the alkyl group described above.Examples of the aromatic group may include the aryl group describedabove.

R⁸, R⁹, R¹¹, and R¹² are each a hydrogen atom or a methyl group and R⁷and R¹⁰ are each a C₁₋₁₀ alkyl group or a C₆₋₄₀ aryl group.

n9 is an integer of 1≤n9≤3; n10 is an integer of 2≤n10≤5; n11 is aninteger of 0≤n11≤3; n12 is an integer of 0≤n12≤3; and a total of theintegers is an integer of 3≤(n9+n10+n11+n12)≤6.

n13 is an integer of 1≤n13≤3; n14 is an integer of 1≤n14≤4; n15 is aninteger of 0≤n15≤3; n16 is an integer of 0≤n16≤3; and a total of theintegers is an integer of 2≤(n13+n14+n15+n16)≤5. m2 is an integer of 2to 10.

The reaction of the compound of Formula (3) or Formula (4) with theether compound containing a hydroxy group or the C₂₋₁₀ alcohol iscarried out in the presence of an acid catalyst.

Examples of the acid catalyst to be used may include acidic compoundssuch as p-toluenesulfonic acid, trifluoromethanesulfonic acid,pyridinium p-toluenesulfonate, salicylic acid, 5-sulfosalicylic acid,4-phenolsulfonic acid, camphorsulfonic acid, 4-chlorobenzenesulfonicacid, benzenedisulfonic acid, 1-naphthalenesulfonic acid, citric acid,benzoic acid, hydroxybenzoic acid, and naphthalene carboxylic acid.

As the acid catalyst, an ion-exchange resin can be used in order not toleave an unreacted acid in the reaction system. Examples of theion-exchange resin to be used may include a sulfonic acid-based strongacid ion-exchange resin.

Examples of the ether compound containing a hydroxy group may includepropylene glycol monomethyl ether or propylene glycol monoethyl ether.

Examples of the C₂₋₁₀ alcohol may include ethanol, 1-propanol,2-methyl-1-propanol, butanol, 2-methoxyethanol, or 2-ethoxyethanol.

The crosslinkable compound of Formula (1) or Formula (2) used in thepresent invention, for example, can be exemplified as follows:

The compound of Formula (3) or Formula (4) used in the presentinvention, for example, can be exemplified as follows:

As the resin used in the present invention, a resin can be used as longas this resin can form a crosslinking reaction with the crosslinkablecompound. Examples of the crosslink forming group existing in the resinmay include a hydroxy group, a carboxy group, an amino group, and analkoxy group.

Examples of the resin having these crosslink forming groups may includean acrylic resin and a novolac resin, and the novolac resin can bepreferably used.

The novolac resin can be obtained by reacting an aromaticring-containing compound with an aldehyde compound or a ketone compoundin the presence of an acid catalyst. Examples of the aromaticring-containing compound may include benzene, phenol, naphthalene,phloroglucinol, hydroxynaphthalene, fluorene, carbazole, bisphenol,bisphenol S, diphenylamine, triphenylamine, phenylnaphthylamine,anthracene, hydroxyanthracene, phenothiazine, phenoxazine, phenylindole,and polyphenols.

Examples of the aldehyde may include saturated aliphatic aldehydes suchas formaldehyde, paraformaldehyde, acetaldehyde, propylaldehyde,butyraldehyde, isobutyraldehyde, valeraldehyde, capronaldehyde,2-methylbutyraldehyde, hexylaldehyde, undecanealdehyde,7-methoxy-3,7-dimethyloctylaldehyde, cyclohexanealdehyde,3-methyl-2-butyraldehyde, glyoxal, malonaldehyde, succinaldehyde,glutaraldehyde, and adipaldehyde, unsaturated aliphatic aldehydes suchas acrolein and methacrolein, heterocyclic aldehydes such as furfuraland pyridinealdehyde, and aromatic aldehydes such as benzaldehyde,naphthylaldehyde, anthrylaldehydes, phenanthrylaldehydes,salicylaldehyde, phenylacetaldehyde, 3-phenylpropionaldehyde,tolylaldehyde, (N,N-dimethylamino)benzaldehyde, acetoxybenzaldehyde, and1-pyrenecarboxaldehyde.

Examples of the ketone may include diaryl ketones such as diphenylketone, phenyl naphthyl ketone, dinaphthyl ketone, phenyl tolyl ketone,ditolyl ketone, and 9-fluorenone.

The novolac resin used in the present invention is a resin obtained bycondensing the aromatic ring-containing compound with the aldehydecompound or the ketone compound. In this condensation reaction, thealdehydes or the ketones can be used in a ratio of 0.1 equivalent to 10equivalents relative to 1 equivalent of the phenyl group contained inthe heterocyclic group-containing aromatic compound and participating inthe reaction.

Examples of the acid catalyst used in the condensation reaction mayinclude mineral acids such as sulfuric acid, phosphoric acid, andperchloric acid; organic sulfonic acids such as p-toluenesulfonic acid,and p-toluenesulfonic acid monohydrate; and carboxylic acids such asformic acid and oxalic acid. The amount of the acid catalyst to be usedis selected depending on the type of the acid catalyst to be used. Theamount is usually 0.001 part by mass to 10,000 parts by mass, preferably0.01 part by mass to 1,000 parts by mass, and more preferably 0.1 partby mass to 100 parts by mass relative to 100 parts by mass of thecompound comprising an aromatic ring.

The condensation reaction may be carried out without solvent. Thecondensation reaction is, however, usually carried out with solvent. Allof the solvents can be used as long as the solvents do not inhibit thereaction. Examples of the solvent may include ring ethers such astetrahydrofuran and dioxane. When the acid catalyst to be used is aliquid acid such as formic acid, the acid can also act as a solvent. Thereaction temperature at the time of condensation is usually 40° C. to200° C. The reaction time is variously selected depending on thereaction temperature and usually about 30 minutes to about 50 minutes.

In the present invention, as a catalyst for promoting the crosslinkingreaction of the resin with the crosslinkable compound of Formula (1) orFormula (2), acidic compounds such as p-toluenesulfonic acid,trifluoromethanesulfonic acid, pyridinium p-toluenesulfonate, salicylicacid, 5-sulfosalicylic acid, 4-phenolsulfonic acid, camphorsulfonicacid, 4-chlorobenzenesulfonic acid, benzenedisulfonic acid,1-naphthalenesulfonic acid, citric acid, benzoic acid, hydroxybenzoicacid, and naphthalene carboxylic acid and/or thermal acid generatorssuch as 2,4,4,6-tetrabromocyclohexadienone, benzoin tosylate,2-nitrobenzyl tosylate, and other organic sulfonic acid alkyl esters,onium salt-based photoacid generators such asbis(4-t-butylphenyl)iodonium trifluoromethanesulfonate andtriphenylsulfonium trifluoromethanesulfonate, halogen-containingcompound-based photoacid generators such asphenyl-bis(trichloromethyl)-s-triazine, or sulfonic acid-based photoacidgenerators such as benzoin tosylate and N-hydroxysuccinimidetrifluoromethanesulfonate can be added in combination. The amount of thecrosslinking catalyst is 0.0001% by mass to 20% by mass, preferably0.0005% by mass to 10% by mass, and more preferably 0.01% by mass to 3%by mass relative to the whole solid content.

To the resist underlayer film-forming composition for lithography of thepresent invention, for example, a light absorbent, a rheology modifier,an adhesion assistance agent, or a surfactant can be further added inaddition to the components described above if necessary.

The resist underlayer film-forming composition for lithography canfurther contain crosslinking agents other than the crosslinking agentcompound of Formula (1) or Formula (2). Examples of the crosslinkingagent may include a melamine-based agent, a substituted urea-basedagent, or a polymer-based agent thereof. The crosslinking agentpreferably has at least two crosslink-forming substituents. Examples ofthe crosslinking agent may include compounds such as methoxymethylatedglycoluril, butoxymethylated glycoluril, methoxymethylated melamine,butoxymethylated melamine, methoxymethylated benzoguanamine,butoxymethylated benzoguanamine, methoxymethylated urea,butoxymethylated urea, methoxymethylated thiourea, or methoxymethylatedthiourea. A condensate of these compounds can also be used.

As further light absorbents, for example, commercially available lightabsorbents described in “Kogyoyo Shikiso no Gijutu to Shijyo (Technologyand Market of Industrial Colorant)” (CMC Publishing Co., Ltd) and“Senryo Binran (Dye Handbook)” (The Society of Synthetic OrganicChemistry, Japan) can be preferably used. Preferably useable examples ofthe commercially available light absorbents include C. I. DisperseYellow 1, 3, 4, 5, 7, 8, 13, 23, 31, 49, 50, 51, 54, 60, 64, 66, 68, 79,82, 88, 90, 93, 102, 114, and 124; C. I. Disperse Orange 1, 5, 13, 25,29, 30, 31, 44, 57, 72, and 73; C. I. Disperse Red 1, 5, 7, 13, 17, 19,43, 50, 54, 58, 65, 72, 73, 88, 117, 137, 143, 199, and 210; C. I.Disperse Violet 43; C. I. Disperse Blue 96; C. I. FluorescentBrightening Agent 112, 135, and 163; C. I. Solvent Orange 2 and 45; C.I. Solvent Red 1, 3, 8, 23, 24, 25, 27, and 49; C. I. Pigment Green 10;and C. I. Pigment Brown 2. The light absorbents are usually added in aratio of 10% by mass or less, and preferably in a ratio of 5% by mass orless relative to the whole solid content of the resist underlayerfilm-forming composition for lithography.

The rheology modifier is added for the purpose of mainly improvingflowability of the resist underlayer film-forming composition, and,particularly in a baking process, improving film thickness uniformity ofthe resist underlayer film and enhancing filling ability of the resistunderlayer film-forming composition into the inside of a hole. Specificexamples of the rheology modifier may include phthalic acid derivativessuch as dimethyl phthalate, diethyl phthalate, diisobutyl phthalate,dihexyl phthalate, and butylisodecyl phthalate, adipic acid derivativessuch as di-normal-butyl adipate, diisobutyl adipate, diisooctyl adipate,and octyldecyl adipate, maleic acid derivatives such asdi-normal-butylmaleate, diethyl maleate, and dinonyl maleate, oleic acidderivatives such as methyl oleate, butyl oleate, and tetrahydrofurfuryloleate, or stearic acid derivatives such as normal-butyl stearate, andglyceryl stearate. These rheology modifiers are usually added in a ratioof less than 30% by mass relative to the whole solid content of theresist underlayer film-forming composition for lithography.

The adhesion assistance agent is mainly added so that adhesion betweenthe substrate or the resist and the resist underlayer film-formingcomposition is improved and that the resist is not peeled, particularlyin development. Specific examples of the adhesion assistance agent mayinclude chlorosilanes such as trimethylchlorosilane,dimethylvinylchlorosilane, methyldiphenylchlorosilane, andchloromethyldimethylchlorosilane, alkoxysilanes such astrimethylmethoxysilane, dimethyldiethoxysilane, methyldimethoxysilane,dimethylvinylethoxysilane, diphenyldimethoxysilane, andphenyltriethoxysilane, silazanes such as hexamethyldisilazane,N,N-bis(trimethylsilyl)urea, dimethyltrimethylsilylamine, andtrimethylsilylimidazole, silanes such as vinyltrichlorosilane,γ-chloropropyltrimethoxysilane, γ-aminopropyltriethoxysilane, andγ-glycidoxypropyltrimethoxysilane, heterocyclic compounds such asbenzotriazole, benzimidazole, indazole, imidazole,2-mercaptobenzimidazole, 2-mercaptobenzothiazole, 2-mercaptobenzoxazole,urazole, thiouracil, mercaptoimidazole, and mercaptopyrimidine, and ureacompounds or thiourea compounds such as 1,1-dimethylurea and1,3-dimethylurea. These adhesion assistance agents are usually added ina ratio less than 5% by mass, and preferably in a ratio of less than 2%by mass relative to the whole solid content of the resist underlayerfilm-forming composition for lithography.

To the resist underlayer film-forming composition for lithography of thepresent invention, a surfactant can be added for preventing generationof pinholes and striations and further improving applicability tosurface unevenness. Examples of the surfactant may include nonionicsurfactant such as polyoxyethylene alkyl ethers includingpolyoxyethylene lauryl ether, polyoxyethylene stearyl ether,polyoxyethylene cetyl ether, and polyoxyethylene oleyl ether;polyoxyethylene alkylallyl ethers including polyoxyethylene octylphenolether and polyoxyethylene nonylphenol ether;polyoxyethylene-polyoxypropylene block copolymers; sorbitan fatty acidesters including sorbitan monolaurate, sorbitan monopalmitate, sorbitanmonostearate, sorbitan monooleate, sorbitan trioleate, and sorbitantristearate; and polyoxyethylene sorbitan fatty acid esters includingpolyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitanmonopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylenesorbitan trioleate, and polyoxyethylene sorbitan tristearate;fluorochemical surfactants such as EFTOP EF301, EF303, and EF352(manufactured by Tochem Products, trade name), MEGAFAC F171, F173, andR-30 (manufactured by Dainippon Ink and Chemicals Inc., trade name),Fluorad FC430 and FC431 (manufactured by Sumitomo 3M Ltd., trade name),Asahi guard AG710, Surflon S-382, SC101, SC102, SC103, SC104, SC105, andSC106 (manufactured by Asahi Glass Co., Ltd., trade name); andOrganosiloxane Polymer KP341 (manufactured by Shin-Etsu Chemical Co.,Ltd.). The amount of the surfactant to be added is usually 2.0% by massor less and preferably 1.0% by mass or less relative to the whole solidcontent of the resist underlayer film-forming composition forlithography of the present invention. These surfactants can be addedsingly or in combination of two or more of them.

In the resist underlayer film-forming composition of the presentinvention, usable examples of a solvent dissolving the resin, thecrosslinking agent component, the crosslinking catalyst, and the likemay include ethylene glycol monomethyl ether, ethylene glycol monoethylether, methyl cellosolve acetate, ethyl cellosolve acetate, diethyleneglycol monomethyl ether, diethylene glycol monoethyl ether, propyleneglycol, propylene glycol monomethyl ether, propylene glycol monomethylether acetate, propylene glycol monoethyl ether, propylene glycolmonoethyl ether acetate, propylene glycol propyl ether acetate, toluene,xylene, methyl ethyl ketone, cyclopentanone, cyclohexanone, ethyl2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethylethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutanoate,methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl3-ethoxypropionate, methyl 3-ethoxypropionate, methyl pyruvate, ethylpyruvate, ethyl acetate, butyl acetate, ethyl lactate, and butyllactate. These organic solvents can be used singly or in combination oftwo or more of them.

In addition, these solvents can be used by mixing with a high boilingpoint solvent such as propylene glycol monobutyl ether and propyleneglycol monobutyl ether acetate. Among these solvents, propylene glycolmonomethyl ether, propylene glycol monomethyl ether acetate, ethyllactate, butyl lactate, and cyclohexanone are preferable for improving alevering property.

The resist used in the present invention is a photoresist or an electronbeam resist.

As the photoresist applied on the resist underlayer film for lithographyof the present invention, both negative photoresist and positivephotoresist can be used. Examples of the resists include a positivephotoresist made of a novolac resin and1,2-naphthoquinonediazidesulfonate, a chemically amplified photoresistmade of a binder having a group that increases an alkali dissolutionrate by decomposing with an acid and a photoacid generator, a chemicallyamplified photoresist made of an alkali-soluble binder, a low molecularweight compound that increases an alkali dissolution rate of thephotoresist by decomposing with an acid, and a photoacid generator, achemically amplified photoresist made of a binder having a group thatincreases an alkali dissolution rate by decomposing with an acid, a lowmolecular weight compound that increases an alkali dissolution rate ofthe photoresist by decomposing with an acid, and a photoacid generator,and a photoresist having Si atoms in the skeleton of the molecule.Specific examples may include APEX-E (trade name, manufactured by Rohmand Haas Inc.)

Examples of the electron beam resist applied onto the resist underlayerfilm for lithography of the present invention may include a compositionmade of a resin containing Si—Si bonds in the main chain and containingan aromatic ring at its end and an acid generator generating an acid byirradiation with electron beams and a composition made ofpoly(p-hydroxystyrene) in which an organic group containingN-carboxyamine is substituted for a hydroxy group and an acid generatorgenerating an acid by irradiation with electron beams. In the latterelectron beam resist composition, the acid generated from the acidgenerator by the electron beam irradiation is reacted with theN-carboxyaminoxy group of the polymer side chain and the polymer sidechain is decomposed into a hydroxy group to exhibit alkali solubility.Consequently, the resist composition is dissolved into an alkalidevelopment liquid to form a resist pattern. Examples of the acidgenerator generating the acid by electron beam irradiation may includehalogenated organic compounds such as1,1-bis[p-chlorophenyl]-2,2,2-trichloroethane,1,1-bis[p-methoxyphenyl]-2,2,2-trichloroethane,1,1-bis[p-chlorophenyl]-2,2-dichloroethane, and2-chloro-6-(trichloromethyl)pyridine, onium salts such astriphenylsulfonium salts and diphenyliodonium salts, and sulfonates suchas nitrobenzyltosylate and dinitrobenzyltosylate.

As the development liquid for the resist having the resist underlayerfilm formed by using the resist underlayer film film-forming compositionfor lithography of the present invention, the following aqueous alkalisolutions can be used. The aqueous alkali solutions includes solutionsof inorganic alkalis such as sodium hydroxide, potassium hydroxide,sodium carbonate, sodium silicate, sodium metasilicate, and aqueousammonia; primary amines such as ethylamine and n-propylamine; secondaryamines such as diethylamine and di-n-butylamine; tertiary amines such astriethylamine and methyldiethylamine; alcoholamines such asdimethylethanolamine and triethanolamine; quaternary ammonium salt suchas tetramethylammonium hydroxide, tetraethylammonium hydroxide, andcholine; and cyclic amines such as pyrrole and piperidine. To theaqueous solutions of the alkalis described above, an adequate amount ofalcohols such as isopropyl alcohol or a surfactant such as a nonionicsurfactant can be added and the mixture can be used. Among thesedevelopment liquids, aqueous solutions of the quaternary ammonium saltsare preferable and aqueous solutions of tetramethylammonium hydroxideand choline are further preferable.

Subsequently, a method for forming the resist pattern of the presentinvention will be described. The resist underlayer film-formingcomposition is applied onto a substrate (for example, silicon/silicondioxide coating, a glass substrate and a transparent substrate such asan ITO substrate) for use in producing precision integrated circuitelements by an appropriate application method such as a spinner and acoater and thereafter the applied composition is cured by baking to forman application type underlayer film. A film thickness of the resistunderlayer film is preferably 0.01 μm to 3.0 μm. Conditions for bakingafter the application are 80° C. to 350° C. for 0.5 minute to 120minutes. Thereafter, the resist is directly applied onto the resistunderlayer film or applied after forming a film made of one layer orseveral layers of coating material on the application type underlayerfilm if necessary. Thereafter, the resist is irradiated with light orelectron beams through the predetermined mask and is developed, rinsed,and dried to be able to obtain an excellent resist pattern. PostExposure Bake (PEB) of light or electron beams can also be carried outif necessary. The part of the resist underlayer film where the resist isremoved by the previous process is removed by dry etching to be able toform a desired pattern on the substrate.

The exposure light of the photoresist is actinic rays such as nearultraviolet rays, far ultraviolet rays, or extreme ultraviolet rays (forexample, EUV, wavelength 13.5 nm) and, for example, light having awavelength of 248 nm (KrF laser light), 193 nm (ArF laser light), or 157nm (F₂ laser light) is used. Any light irradiation method can be usedwithout limitation as long as the acid is generated from the photoacidgenerator. An exposure amount is 1 mJ/cm² to 2,000 mJ/cm², or 10 mJ/cm²to 1,500 mJ/cm², or 50 mJ/cm² to 1,000 mJ/cm².

The electron beam irradiation to the electron beam resist can be carriedout by, for example, using an electron beam irradiation device.

In the present invention, a semiconductor device can be produced throughsteps of forming a resist underlayer film by using the resist underlayerfilm-forming composition of the present invention onto a semiconductorsubstrate; forming a resist film on the underlayer film; forming aresist pattern by irradiation with light or electron beams anddevelopment; etching the resist underlayer film by using the formedresist pattern; and processing the semiconductor substrate by using thepatterned resist underlayer film.

When the formation of the finer resist pattern will be progressed in thefuture, the problem of resolution and the problem of resist patterncollapse after development will occur and thus formation of a thinnerresist film will be desired. Consequently, the resist pattern thicknesssufficient for substrate processing is difficult to secure. As a result,not only the resist pattern but also the resist underlayer film formedbetween the resist and the semiconductor substrate to be processed hasbeen required to have the function as a mask at the time of thesubstrate processing. As the resist underlayer film for such a process,a resist underlayer film for lithography having the selectivity of dryetching rate close to that of the resist, a resist underlayer film forlithography having the selectivity of dry etching rate smaller than thatof the resist, or a resist underlayer film for lithography having theselectivity of dry etching rate smaller than that of the semiconductorsubstrate, which is different from conventional resist underlayer filmshaving high etch rate properties, has been required. Such a resistunderlayer film can be provided with the function of anti-reflectiveproperties and thus can also have the function of an anti-reflectivecoating.

On the other hand, in order to obtain a finer resist pattern, a processhas been also started to be used in which the resist pattern and theresist underlayer film at the time of resist underlayer film dry etchingare formed more narrowly than the pattern width at the time of resistdevelopment. As the resist underlayer film for such a process, theresist underlayer film having the selectivity of dry etching rate closeto that of the resist, which is different from conventional high etchingrate anti-reflective coatings, has been required. Such a resistunderlayer film can be provided with the anti-reflective properties andthus can also have the function of the conventional anti-reflectivecoating.

In the present invention, after the resist underlayer film of thepresent invention is formed onto the substrate, the resist can beapplied directly onto the resist underlayer film or after a film made ofa single layer or several layers of coating material is formed onto theresist underlayer film. This enables the pattern width of the resist tobe narrow. Even when the resist is thinly covered in order to preventpattern collapse, the substrate can be processed by selecting anappropriate etching gas.

More specifically, the semiconductor device can be manufactured throughsteps of: forming a resist underlayer film onto a semiconductorsubstrate using the resist underlayer film-forming composition; forminga hard mask on the resist underlayer film using a coating materialcontaining a silicon component and the like or a hard mask (for example,silicon nitride oxide) by vapor deposition; forming a resist film on thehard mask; forming a resist pattern by irradiation with light or anelectron beam and development; etching the hard mask using the formedresist pattern with a halogen-based gas; etching the resist underlayerfilm using the patterned hard mask with an oxygen-based gas or ahydrogen-based gas; and processing the semiconductor substrate using thepatterned resist underlayer film with the halogen-based gas.

In consideration of the effect as the anti-reflective coating, theresist underlayer film-forming composition for lithography of thepresent invention includes a light absorption site in the skeleton andthus no substances are diffused into the photoresist at the time ofdrying by heating. The light absorption site has sufficiently largelight absorption properties and thus has a high anti-reflection effect.

The resist underlayer film-forming composition for lithography of thepresent invention has high heat stability, prevents contamination to theupper layer film caused by decomposed substances generated at the timeof baking, and can provide an extra temperature margin during the bakingprocess.

Depending on process conditions, the resist underlayer film-formingcomposition for lithography of the present invention can be used as afilm that has the anti-reflection function and further has a functionthat prevents interaction between the substrate and the photoresist orprevents adverse effect on the substrate due to the materials for use inthe photoresist or substances generated at the time of light exposure tothe photoresist.

The present invention also relates to a new compound of Formula (5):

(where Q³ is an isopropylidene group (—C(CH₃)₂—); R¹⁴ is a C₂₋₁₀ alkylgroup or a C₂₋₁₀ alkyl group having a C₁₋₁₀ alkoxy group; R¹⁵ is ahydrogen atom or a methyl group; R¹³ is a C₁₋₁₀ alkyl group or a C₆₋₄₀aryl group;

n17 is an integer of 1≤n17≤3; n18 is an integer of 1≤n18≤4; n19 is aninteger of 0≤n19≤3; n20 is an integer of 0≤n20≤3; and a total of theintegers is an integer of 2≤(n17+n18+n19+n20)≤5).

As the alkyl group, the alkoxy group, and the aryl group, the aboveexamples can be exemplified.

EXAMPLES Synthesis Example 1

To a 100 mL recovery flask, TMOM-BP (20.00 g, 0.055 mol, manufactured byHonshu Chemical Industry Co., Ltd., Formula (4-23)) and PGME (propyleneglycol monomethyl ether, 80.00 g) were charged and the mixture wasstirred. The temperature of the mixture was raised until reflux wasconfirmed to dissolve the mixture and to start polymerization. 24 hourslater, the reaction product was left to cool down to 30° C. Thereafter,TMOM-BP-PGME (a compound corresponding to Formula (3-4) was a mainproduct and compounds of Formula (3-1), Formula (3-2), and Formula (3-3)were mixed in the compound of Formula (3-4)) in the PGME solution wasobtained. As a result of identification of an existence ratio of thetetra-substituted compound of TMOM-BP-PGME carried out by GPC, thetetra-substituted compound existed in a ratio of 34 mol % in the wholeTMOM-BP-PGME.

Synthesis Example 2

To a 200 mL recovery flask, TMOM-BP (5.00 g, 0.014 mol, manufactured byHonshu Chemical Industry Co., Ltd., Formula (4-23)), washed 15JWET(20.00 g, trade name Amberlist, manufactured by The Dow ChemicalCompany) as an ion-exchange resin catalyst, and PGME (propylene glycolmonomethyl ether, 75.00 g) were charged and the mixture was stirred. Thetemperature of the mixture was raised until reflux was confirmed todissolve the mixture and to start polymerization. 48 hours later, thereaction product was left to cool down to 60° C. Thereafter, 15JWET wasremoved by filtration and the obtained precipitate was filtered to givea target product (a compound corresponding to Formula (3-4) was a mainproduct and compounds of Formula (3-1), Formula (3-2), and Formula (3-3)were mixed in the compound of Formula (3-4), hereinafter abbreviated asTMOM-BP-PGME2).

As a result of identification of an existence ratio of thetetra-substituted compound of TMOM-BP-PGME2 carried out by GPC, thetetra-substituted compound existed in a ratio of 68 mol % in the wholeTMOM-BP-PGME2.

Synthesis Example 3

To a 200 mL four-necked flask, TMOM-BP (3.00 g, 0.008 mol, manufacturedby Honshu Chemical Industry Co., Ltd., Formula (4-23)) and washed 15JWET(12.00 g, trade name Amberlist, manufactured by The Dow ChemicalCompany) as an ion-exchange resin catalyst were added and butanol (60.00g, manufactured by KANTO CHEMICAL CO., INC.) was charged. The mixturewas stirred to start polymerization at 100° C. 48 hour later, thereaction product was left to cool down to 30° C. Thereafter, 15JWET wasremoved by filtration and the filtrate was concentrated at 30° C. underreduced pressure for 2 hours and dried to give 2.9 g of the targetmaterial (hereinafter abbreviated as TBOM-BP-BU; a compoundcorresponding to Formula (3-8) was a main product and compounds ofFormula (3-5), Formula (3-6), and Formula (3-7) were mixed in thecompound of Formula (3-8)).

Structure analysis was carried out with ¹H-NMR to confirm that thetarget compound was obtained. The existence ratio of thetetra-substituted compound of TBOM-BP-BU was confirmed to be 85 mol % inthe whole TBOM-BP-BU with HPLC.

The NMR spectrum of the tetra-substituted compound of TBOM-BP-BU showedthe following characteristic absorptions (FIG. 1).

¹H-NMR (500 MHz, DMSO-d6): 0.89 ppm (t, 12H), 1.36 ppm (m, 8H), 1.54 ppm(m, 8H), 3.49 (t, 8H), 4.54 (s, 8H), 7.34 (s, 4H), 8.50 (s, 2H).

Synthesis Example 4

To a 200 mL four-necked flask, TM-BIP-A (3.00 g, 0.009 mol, manufacturedby Honshu Chemical Industry Co., Ltd., Formula (4-24)) and washed 15JWET(12.00 g, trade name Amberlist, manufactured by The Dow ChemicalCompany) as an ion-exchange resin catalyst were added and butanol (60.00g, manufactured by KANTO CHEMICAL CO., INC.) was charged. The mixturewas stirred to start polymerization at 100° C. 3.5 hours later, thereaction product was left to cool down to 30° C. Thereafter, 15JWET wasremoved by filtration and the filtrate was concentrated at 30° C. underreduced pressure for 2 hours and dried to give 3.0 g of the targetmaterial (a compound corresponding to Formula (3-12) was a main productand compounds of Formula (3-9), Formula (3-10), and Formula (3-11) weremixed in the compound of Formula (3-12); hereinafter abbreviated asTBOM-BIP-A).

Structure analysis was carried out with ¹H-NMR to confirm that thetarget compound was obtained. The existence ratio of thetetra-substituted compound of TBOM-BIP-A was confirmed to be 95 mol % inthe whole TBOM-BIP-A with HPLC.

The NMR spectrum of the tetra-substituted compound of TBOM-BIP-A showedthe following characteristic absorptions (FIG. 2).

¹H-NMR (500 MHz, DMSO-d6): 0.85 ppm (t, 12H), 1.30 ppm (m, 8H), 1.47 ppm(m, 8H), 1.54 ppm (s, 6H), 3.38 (t, 8H), 4.42 (s, 8H), 6.99 (s, 4H),8.19 (s, 2H).

Synthesis Example 5

To a 200 mL four-necked flask, TM-BIP-A (4.00 g, 0.011 mol, manufacturedby Honshu Chemical Industry Co., Ltd., Formula (4-24)) and washed 15JWET(16.00 g, trade name Amberlist, manufactured by The Dow ChemicalCompany) as an ion-exchange resin catalyst were added and 1-propanol(80.00 g, manufactured by KANTO CHEMICAL CO., INC.) was charged. Themixture was stirred to start polymerization at a reflux temperature. 4hours later, the reaction product was left to cool down to 30° C.Thereafter, 15JWET was removed by filtration and the filtrate wasconcentrated at 30° C. under reduced pressure for 2 hours and dried togive 5.0 g of the target material (a compound corresponding to Formula(3-16) was a main product and compounds of Formula (3-13), Formula(3-14), and Formula (3-15) were mixed in the compound of Formula (3-16);hereinafter abbreviated as TPOM-BIP-A).

Structure analysis was carried out with ¹H-NMR to confirm that thetarget compound was obtained. The existence ratio of thetetra-substituted compound of TPOM-BIP-A was confirmed to be 94 mol % inthe whole TPOM-BIP-A with HPLC.

The NMR spectrum of the tetra-substituted compound of TPOM-BIP-A showedthe following characteristic absorptions (FIG. 3).

¹H-NMR (500 MHz, DMSO-d6): 0.84 ppm (t, 12H), 1.49 ppm (m, 8H), 1.55 ppm(s, 6H), 3.34 (t, 8H), 4.43 (s, 8H), 7.00 (s, 4H), 8.19 (s, 2H).

Synthesis Example 6

To a 200 mL four-necked flask, TM-BIP-A (4.00 g, 0.011 mol, manufacturedby Honshu Chemical Industry Co., Ltd., Formula (4-24)) and washed 15JWET(16.00 g, trade name Amberlist, manufactured by The Dow ChemicalCompany) as an ion-exchange resin catalyst were added and ethanol (80.00g, manufactured by KANTO CHEMICAL CO., INC.) was charged. The mixturewas stirred to start polymerization at a reflux temperature. 19.5 hourslater, the reaction product was left to cool down to 30° C. Thereafter,15JWET was removed by filtration and the filtrate was concentrated at30° C. under reduced pressure for 2 hours and dried to give 4.2 g of thetarget material (a compound corresponding to Formula (3-20) was a mainproduct and compounds of Formula (3-17), Formula (3-18), and Formula(3-19) were mixed in the compound of Formula (3-20); hereinafterabbreviated as TEOM-BIP-A).

Structure analysis was carried out with ¹H-NMR to confirm that thetarget compound was obtained. The existence ratio of thetetra-substituted compound of TEOM-BIP-A was confirmed to be 95 mol % inthe whole TEOM-BIP-A with HPLC.

The NMR spectrum of the tetra-substituted compound of TEOM-BIP-A showedthe following characteristic absorptions (FIG. 4).

¹H-NMR (500 MHz, DMSO-d6): 1.10 ppm (t, 12H), 1.55 ppm (s, 6H), 3.44 (q,8H), 4.42 (s, 8H), 6.99 (s, 4H), 8.22 (s, 2H).

Synthesis Example 7

To a 200 mL four-necked flask, TM-BIP-A (4.00 g, 0.011 mol, manufacturedby Honshu Chemical Industry Co., Ltd., Formula (4-24)) and washed 15JWET(16.00 g, trade name Amberlist, manufactured by The Dow ChemicalCompany) as an ion-exchange resin catalyst were added and2-methyl-1-propanol (80.00 g, manufactured by KANTO CHEMICAL CO., INC.)was charged. The mixture was stirred to start polymerization at 100° C.4 hours later, the reaction product was left to cool down to 30° C.Thereafter, 15JWET was removed by filtration and the filtrate wasconcentrated at 30° C. under reduced pressure for 2 hours and dried togive 5.8 g of the target material (a compound corresponding to Formula(3-24) was a main product and compounds of Formula (3-21), Formula(3-22), and Formula (3-23) were mixed in the compound of Formula (3-24);hereinafter abbreviated as TIBOM-BIP-A).

Structure analysis was carried out with ¹H-NMR to confirm that thetarget compound was obtained. The existence ratio of thetetra-substituted compound of TIBOM-BIP-A was confirmed to be 95 mol %in the whole TIBOM-BIP-A with HPLC.

The NMR spectrum of the tetra-substituted compound of TIBOM-BIP-A showedthe following characteristic absorptions (FIG. 5).

¹H-NMR (500 MHz, DMSO-d6): 0.83 ppm (d, 24H), 1.55 ppm (s, 6H), 1.77 (m,4H), 3.15 (t, 8H), 4.44 (s, 8H), 7.01 (s, 4H), 8.16 (s, 2H).

Synthesis Example 8

To a 200 mL four-necked flask, TM-BIP-A (4.00 g, 0.011 mol, manufacturedby Honshu Chemical Industry Co., Ltd., Formula (4-24)) and washed 15JWET(16.00 g, trade name Amberlist, manufactured by The Dow ChemicalCompany) as an ion-exchange resin catalyst were added and2-methoxyethanol (80.00 g, manufactured by KANTO CHEMICAL CO., INC.) wascharged. The mixture was stirred to start polymerization at 100° C. Onehour later, the reaction product was left to cool down to 30° C.Thereafter, 15JWET was removed by filtration and the filtrate wasconcentrated at 30° C. under reduced pressure for 2 hours and dried togive 5.3 g of the target material (a compound corresponding to Formula(3-28) was a main product and compounds of Formula (3-25), Formula(3-26), and Formula (3-27) were mixed in the compound of Formula (3-28);hereinafter abbreviated as EGME-BIP-A).

Structure analysis was carried out with ¹H-NMR to confirm that thetarget compound was obtained. The existence ratio of thetetra-substituted compound of EGME-BIP-A was confirmed to be 94 mol % inthe whole EGME-BIP-A with HPLC.

The NMR spectrum of the tetra-substituted compound of EGME-BIP-A showedthe following characteristic absorptions (FIG. 6).

¹H-NMR (500 MHz, DMSO-d6): 1.55 ppm (s, 6H), 3.23 ppm (s, 12H), 3.44 ppm(m, 8H), 3.53 ppm (m, 8H), 4.46 (s, 8H), 7.01 (s, 4H), 8.20 (s, 2H).

Synthesis Example 9

To a 200 mL four-necked flask, TM-BIP-A (4.00 g, 0.011 mol, manufacturedby Honshu Chemical Industry Co., Ltd., Formula (4-24)) and washed 15JWET(16.00 g, trade name Amberlist, manufactured by The Dow ChemicalCompany) as an ion-exchange resin catalyst were added and2-ethoxyethanol (80.00 g, manufactured by KANTO CHEMICAL CO., INC.) wascharged. The mixture was stirred to start polymerization at 100° C. Onehour later, the reaction product was left to cool down to 30° C.Thereafter, 15JWET was removed by filtration and the filtrate wasconcentrated at 30° C. under reduced pressure for 2 hours and dried togive 3.0 g of the target material (a compound corresponding to Formula(3-32) was a main product and compounds of Formula (3-29), Formula(3-30), and Formula (3-31) were mixed in the compound of Formula (3-32);hereinafter abbreviated as EGEE-BIP-A).

Structure analysis was carried out with ¹H-NMR to confirm that thetarget compound was obtained. The existence ratio of thetetra-substituted compound of EGEE-BIP-A was confirmed to be 92 mol % inthe whole EGEE-BIP-A with HPLC.

The NMR spectrum of the tetra-substituted compound of EGEE-BIP-A showedthe following characteristic absorptions (FIG. 7).

¹H-NMR (500 MHz, DMSO-d6): 1.09 ppm (t, 12H), 1.55 ppm (s, 6H), 3.42 ppm(m, 8H), 3.5 ppm (m, 16H), 4.46 (s, 8H), 7.01 (s, 4H), 8.17 (s, 2H).

Synthesis Example 10

To a 200 mL four-necked flask, TM-BIP-A (4.00 g, 0.011 mol, manufacturedby Honshu Chemical Industry Co., Ltd., Formula (4-24)) and washed 15JWET(16.00 g, trade name Amberlist, manufactured by The Dow ChemicalCompany) as an ion-exchange resin catalyst were added and PGME (80.00 g,manufactured by KANTO CHEMICAL CO., INC.) was charged. The mixture wasstirred to start polymerization at 100° C. One hour later, the reactionproduct was left to cool down to 30° C. Thereafter, 15JWET was removedby filtration and the filtrate was concentrated at 30° C. under reducedpressure for 2 hours and dried to give 3.0 g of the target material (acompound corresponding to Formula (3-36) was a main product andcompounds of Formula (3-33), Formula (3-34), and Formula (3-35) weremixed in the compound of Formula (3-36); hereinafter abbreviated asPGME-BIP-A).

Structure analysis was carried out with ¹H-NMR to confirm that thetarget compound was obtained. The existence ratio of thetetra-substituted compound of PGME-BIP-A was confirmed to be 74 mol % inthe whole PGME-BIP-A with HPLC.

The NMR spectrum of the tetra-substituted compound of PGME-BIP-A showedthe following characteristic absorptions (FIG. 8).

¹H-NMR (500 MHz, DMSO-d6): 1.06 ppm (d, 12H), 1.55 ppm, (s, 6H), 3.25ppm (s, 12H), 3.30 ppm (m, 8H), 3.63 ppm (m, 4H), 4.51 (q, 8H), 7.02 (s,4H), 8.07 (s, 2H).

Synthesis Example 11

To a 200 mL four-necked flask, TM-BIP-A (4.00 g, 0.011 mol, manufacturedby Honshu Chemical Industry Co., Ltd., Formula (4-24)) and washed 15JWET(8.00 g, trade name Amberlist, manufactured by The Dow Chemical Company)as an ion-exchange resin catalyst were added and ethylene glycolisopropyl ether (80.00 g, manufactured by KANTO CHEMICAL CO., INC.) wascharged. The mixture was stirred to start polymerization at 40° C. 22hours later, the temperature of the mixture was raised to 70° C. tocarry out the reaction for 12 hours. After the reacted mixture was leftto cool, 15JWET was removed by filtration. The filtrate was concentratedat 30° C. under reduced pressure for 2 hours and dried to obtain 3.0 gof the target material (a compound corresponding to Formula (3-40) was amain product and compounds of Formula (3-37), Formula (3-38), andFormula (3-39) were mixed in the compound of Formula (3-40); hereinafterabbreviated as EGIPE-BIP-A).

Structure analysis was carried out with ¹H-NMR to confirm that thetarget compound was obtained. The existence ratio of thetetra-substituted compound of EGIPE-BIP-A was confirmed to be 84 mol %in the whole EGIPE-BIP-A with HPLC.

The NMR spectrum of the tetra-substituted compound of EGIPE-BIP-A showedthe following characteristic absorptions (FIG. 9).

¹H-NMR (500 MHz, DMSO-d6): 1.07 ppm (t, 24H), 1.55 ppm (s, 6H),3.45-3.57 ppm (m, 20H), 4.47 (s, 8H), 7.00 (s, 4H), 8.14 (s, 2H).

Synthesis Example 12

To a 100 mL four-necked flask, N-phenyl-1-naphthylamine (10.00 g, 0.046mol, manufactured by Tokyo Chemical Industry Co., Ltd.),1-naphthaldehyde (7.12 g, 0.046 mol, manufactured by Tokyo ChemicalIndustry Co., Ltd.), and Para-toluenesulfonic acid monohydrate (0.908 g,0.0046 mol, manufactured by KANTO CHEMICAL CO., INC.) were added and1,4-dioxane (21.03 g, manufactured by KANTO CHEMICAL CO., INC.) wascharged, followed by stirring the mixture. The temperature of themixture was raised to 110° C. to dissolve the mixture and to startpolymerization. 12 hours later, the reaction product was left to cooldown to room temperature and thereafter reprecipitated in methanol (400g, KANTO CHEMICAL CO., INC.). The obtained precipitate was filtered anddried with a vacuum dryer at 50° C. for 10 hours and further at 120° C.for 24 hours to give 11.6 g of the target polymer (corresponding toFormula (5-1), hereinafter abbreviated as pNPNA-NA). The weight averagemolecular weight Mw of the pNPNA-NA measured with GPC in terms ofpolystyrene was 1,400 and the degree of multiple distribution Mw/Mn was1.62.

Example 1

0.10 g of TMOM-BP-PGME in Synthesis Example 1 as a crosslinking agent,0.02 g of pPTS (pyridinium para-toluenesulfonate) as a catalyst, and0.001 g of MEGAFAC R-30N (manufactured by Dainippon Ink and ChemicalsInc., trade name) as a surfactant were mixed with 0.51 g of pNPNA-NAresin obtained in Synthesis Example 12, and the mixture was dissolved in7.16 g of PGMEA (propylene glycol monomethyl ether acetate), 1.52 g ofPGME, and 2.39 g of cyclohexanone to prepare a solution. Thereafter, thesolution was filtered with a polyethylene microfilter having a porediameter of 0.10 μm and then further filtered with a polyethylenemicrofilter having a pore diameter of 0.05 μm to prepare a solution of aresist underlayer film-forming composition for use in a lithographyprocess by a multilayer film.

Example 2

0.10 g of TMOM-BP-PGME2 in Synthesis Example 2 as a crosslinking agent,0.02 g of pPTS as a catalyst, and 0.001 g of MEGAFAC R-30N (manufacturedby Dainippon Ink and Chemicals Inc., trade name) as a surfactant weremixed with 0.51 g of pNPNA-NA resin obtained in Synthesis Example 12,and the mixture was dissolved in 7.16 g of PGMEA (propylene glycolmonomethyl ether acetate), 1.52 g of PGME, and 2.39 g of cyclohexanoneto prepare a solution. Thereafter, the solution was filtered with apolyethylene microfilter having a pore diameter of 0.10 μm and thenfurther filtered with a polyethylene microfilter having a pore diameterof 0.05 μm to prepare a solution of a resist underlayer film-formingcomposition for use in a lithography process by a multilayer film.

Example 3

0.10 g of TBOM-BP-BU in Synthesis Example 3 as a crosslinking agent,0.02 g of pPTS as a catalyst, and 0.001 g of MEGAFAC R-30N (manufacturedby Dainippon Ink and Chemicals Inc., trade name) as a surfactant weremixed with 0.51 g of pNPNA-NA resin obtained in Synthesis Example 12,and the mixture was dissolved in 7.16 g of PGMEA (propylene glycolmonomethyl ether acetate), 1.52 g of PGME, and 2.39 g of cyclohexanoneto prepare a solution. Thereafter, the solution was filtered with apolyethylene microfilter having a pore diameter of 0.10 μm and thenfurther filtered with a polyethylene microfilter having a pore diameterof 0.05 μm to prepare a solution of a resist underlayer film-formingcomposition for use in a lithography process by a multilayer film.

Example 4

0.10 g of TBOM-BIP-A in Synthesis Example 4 as a crosslinking agent,0.02 g of pPTS as a catalyst, and 0.001 g of MEGAFAC R-30N (manufacturedby Dainippon Ink and Chemicals Inc., trade name) as a surfactant weremixed with 0.51 g of pNPNA-NA resin obtained in Synthesis Example 12,and the mixture was dissolved in 7.16 g of PGMEA (propylene glycolmonomethyl ether acetate), 1.52 g of PGME, and 2.39 g of cyclohexanoneto prepare a solution. Thereafter, the solution was filtered with apolyethylene microfilter having a pore diameter of 0.10 μm and thenfurther filtered with a polyethylene microfilter having a pore diameterof 0.05 μm to prepare a solution of a resist underlayer film-formingcomposition for use in a lithography process by a multilayer film.

Example 5

0.10 g of TPOM-BIP-A in Synthesis Example 5 as a crosslinking agent,0.02 g of pPTS as a catalyst, and 0.001 g of MEGAFAC R-30N (manufacturedby Dainippon Ink and Chemicals Inc., trade name) as a surfactant weremixed with 0.51 g of pNPNA-NA resin obtained in Synthesis Example 12,and the mixture was dissolved in 7.16 g of PGMEA (propylene glycolmonomethyl ether acetate), 1.52 g of PGME, and 2.39 g of cyclohexanoneto prepare a solution. Thereafter, the solution was filtered with apolyethylene microfilter having a pore diameter of 0.10 μm and thenfurther filtered with a polyethylene microfilter having a pore diameterof 0.05 μm to prepare a solution of a resist underlayer film-formingcomposition for use in a lithography process by a multilayer film.

Example 6

0.10 g of TEOM-BIP-A in Synthesis Example 6 as a crosslinking agent,0.02 g of pPTS as a catalyst, and 0.001 g of MEGAFAC R-30N (manufacturedby Dainippon Ink and Chemicals Inc., trade name) as a surfactant weremixed with 0.51 g of pNPNA-NA resin obtained in Synthesis Example 12,and the mixture was dissolved in 7.16 g of PGMEA (propylene glycolmonomethyl ether acetate), 1.52 g of PGME, and 2.39 g of cyclohexanoneto prepare a solution. Thereafter, the solution was filtered with apolyethylene microfilter having a pore diameter of 0.10 μm and thenfurther filtered with a polyethylene microfilter having a pore diameterof 0.05 μm to prepare a solution of a resist underlayer film-formingcomposition for use in a lithography process by a multi layer film.

Example 7

0.10 g of TIBOM-BIP-A in Synthesis Example 7 as a crosslinking agent,0.02 g of pPTS as a catalyst, and 0.001 g of MEGAFAC R-30N (manufacturedby Dainippon Ink and Chemicals Inc., trade name) as a surfactant weremixed with 0.51 g of pNPNA-NA resin obtained in Synthesis Example 12,and the mixture was dissolved in 7.16 g of PGMEA (propylene glycolmonomethyl ether acetate), 1.52 g of PGME, and 2.39 g of cyclohexanoneto prepare a solution. Thereafter, the solution was filtered with apolyethylene microfilter having a pore diameter of 0.10 μm and thenfurther filtered with a polyethylene microfilter having a pore diameterof 0.05 μm to prepare a solution of a resist underlayer film-formingcomposition for use in a lithography process by a multilayer film.

Example 8

0.10 g of EGME-BIP-A in Synthesis Example 8 as a crosslinking agent,0.02 g of pPTS as a catalyst, and 0.001 g of MEGAFAC R-30N (manufacturedby Dainippon Ink and Chemicals Inc., trade name) as a surfactant weremixed with 0.51 g of pNPNA-NA resin obtained in Synthesis Example 12,and the mixture was dissolved in 7.16 g of PGMEA (propylene glycolmonomethyl ether acetate), 1.52 g of PGME, and 2.39 g of cyclohexanoneto prepare a solution. Thereafter, the solution was filtered with apolyethylene microfilter having a pore diameter of 0.10 μm and thenfurther filtered with a polyethylene microfilter having a pore diameterof 0.05 μm to prepare a solution of a resist underlayer film-formingcomposition for use in a lithography process by a multilayer film.

Example 9

0.10 g of EGEE-BIP-A in Synthesis Example 9 as a crosslinking agent,0.02 g of pPTS as a catalyst, and 0.001 g of MEGAFAC R-30N (manufacturedby Dainippon Ink and Chemicals Inc., trade name) as a surfactant weremixed with 0.51 g of pNPNA-NA resin obtained in Synthesis Example 12,and the mixture was dissolved in 7.16 g of PGMEA (propylene glycolmonomethyl ether acetate), 1.52 g of PGME, and 2.39 g of cyclohexanoneto prepare a solution. Thereafter, the solution was filtered with apolyethylene microfilter having a pore diameter of 0.10 μm and thenfurther filtered with a polyethylene microfilter having a pore diameterof 0.05 μm to prepare a solution of a resist underlayer film-formingcomposition for use in a lithography process by a multilayer film.

Example 10

0.10 g of PGME-BIP-A in Synthesis Example 10 as a crosslinking agent,0.02 g of pPTS as a catalyst, and 0,001 g of MEGAFAC R-30N (manufacturedby Dainippon Ink and Chemicals Inc., trade name) as a surfactant weremixed with 0.51 g of pNPNA-NA resin obtained in Synthesis Example 12,and the mixture was dissolved in 7.16 g of PGMEA (propylene glycolmonomethyl ether acetate), 1.52 g of PGME, and 2.39 g of cyclohexanoneto prepare a solution. Thereafter, the solution was filtered with apolyethylene microfilter having a pore diameter of 0.10 μm and thenfurther filtered with a polyethylene microfilter having a pore diameterof 0.05 μm to prepare a solution of a resist underlayer film-formingcomposition for use in a lithography process by a multilayer film.

Example 11

0.10 g of EGIPE-BIP-A in Synthesis Example 11 as a crosslinking agent,0.02 g of pPTS as a catalyst, and 0.001 g of MEGAFAC R-30N (manufacturedby Dainippon Ink and Chemicals Inc., trade name) as a surfactant weremixed with 0.51 g of pNPNA-NA resin obtained in Synthesis Example 12,and the mixture was dissolved in 7.16 g of PGMEA (propylene glycolmonomethyl ether acetate), 1.52 g of PGME, and 2.39 g of cyclohexanoneto prepare a solution. Thereafter, the solution was filtered with apolyethylene microfilter having a pore diameter of 0.10 μm and thenfurther filtered with a polyethylene microfilter having a pore diameterof 0.05 μm to prepare a solution of a resist underlayer film-formingcomposition for use in a lithography process by a multilayer film.

Comparative Example 1

0.10 g of TMOM-BP (manufactured by Honshu Chemical Industry Co., Ltd.,Formula (4-23)) as a crosslinking agent, 0.02 g of pPTS as a catalyst,and 0.001 g of MEGAFAC R-30N (manufactured by Dainippon Ink andChemicals Inc., trade name) as a surfactant were mixed with 0.51 g ofpNPNA-NA resin obtained in Synthesis Example 12, and the mixture wasdissolved in 7.16 g of PGMEA (propylene glycol monomethyl etheracetate), 1.52 g of PGME, and 2.39 g of cyclohexanone to prepare asolution. Thereafter, the solution was filtered with a polyethylenemicrofilter having a pore diameter of 0.10 μm and then further filteredwith a polyethylene microfilter having a pore diameter of 0.05 μm toprepare a solution of a resist underlayer film-forming composition foruse in a lithography process by a multilayer film.

Comparative Example 2

0.10 g of TM-BIP-A (manufactured by Honshu Chemical Industry Co., Ltd.,Formula (4-24)) as a crosslinking agent, 0.02 g of pPTS as a catalyst,and 0.001 g of MEGAFAC R-30N (manufactured by Dainippon Ink andChemicals Inc., trade name) as a surfactant were mixed with 0.51 g ofpNPNA-NA resin obtained in Synthesis Example 12, and the mixture wasdissolved in 7.16 g of PGMEA (propylene glycol monomethyl etheracetate), 1.52 g of PGME, and 2.39 g of cyclohexanone to prepare asolution. Thereafter, the solution was filtered with a polyethylenemicrofilter having a pore diameter of 0.10 μm and then further filteredwith a polyethylene microfilter having a pore diameter of 0.05 μm toprepare a solution of a resist underlayer film-forming composition foruse in a lithography process by a multilayer film.

Comparative Example 3

0.10 g of tetramethoxymethyl glycoluril as a crosslinking agent, 0.02 gof pPTS as a catalyst, and 0.001 g of MEGAFAC R-30N (manufactured byDainippon Ink and Chemicals Inc., trade name) as a surfactant were mixedwith 0.51 g of pNPNA-NA resin obtained in Synthesis Example 12, and themixture was dissolved in 7.16 g of PGMEA (propylene glycol monomethylether acetate), 1.52 g of PGME, and 2.39 g of cyclohexanone to prepare asolution. Thereafter, the solution was filtered with a polyethylenemicrofilter having a pore diameter of 0.10 μm and then further filteredwith a polyethylene microfilter having a pore diameter of 0.05 μm toprepare a solution of a resist underlayer film-forming composition foruse in a lithography process by a multilayer film.

Comparative Example 4

0.10 g of tetrabutoxymethyl glycoluril as a crosslinking agent, 0.02 gof pPTS as a catalyst, and 0.001 g of MEGAFAC R-30N (manufactured byDainippon Ink and Chemicals Inc., trade name) as a surfactant were mixedwith 0.51 g of pNPNA-NA resin obtained in Synthesis Example 12, and themixture was dissolved in 7.16 g of PGMEA (propylene glycol monomethylether acetate), 1.52 g of PGME, and 2.39 g of cyclohexanone to prepare asolution. Thereafter, the solution was filtered with a polyethylenemicrofilter having a pore diameter of 0.10 μm and then further filteredwith a polyethylene microfilter having a pore diameter of 0.05 μm toprepare a solution of a resist underlayer film-forming composition foruse in a lithography process by a multilayer film.

(Measurement of Sublimate Amount)

The sublimate amount was measured with sublimate amount measurementapparatus described in WO 2007/111147 Pamphlet. First, each of theresist underlayer film-forming compositions prepared in Examples 1 to 11and Comparative Examples 1 to 4 was applied onto a silicon wafersubstrate having a diameter of 4 inch with a spin coater so that thefilm thickness was 100 nm. The wafer onto which the resist underlayerfilm was applied was placed in the sublimate amount measurementapparatus integrally equipped with a hot plate and baked for 120 secondsto collect the sublimate into a QCM (Quartz Crystal Microbalance)sensor, that is, a quartz oscillator on which electrodes were formed.The QCM sensor can measure a slight mass change by using a property thatattachment of the sublimate to the surface (electrodes) of the quartzoscillator changes (decreases) the frequency of the quartz oscillatordepending on the mass of the attached sublimate.

Detailed measurement procedure is as follows. The temperature of the hotplate in the sublimate amount measurement apparatus was raised to themeasurement temperature listed in Table 1. A pump flow rate was set to 1m³/s and the apparatus was left to stand for the first 60 seconds forstabilizing the apparatus. Immediately thereafter, the wafer coveredwith the resist underlayer film was quickly placed on the hot platethrough a sliding opening. The sublimate generated from 60 seconds to180 seconds after the placement (during 120 seconds) was collected. TheQCM sensor of the sublimate amount measurement apparatus and a flowattachment (detection part) connected to a collection funnel part wereused without attaching nozzles. Consequently, air flow inflows withoutbeing narrowed from a channel (a bore diameter: 32 mm) of a chamber unithaving a distance to the sensor (quartz oscillator) of 30 mm. As the QCMsensor, a material made of silicon and aluminum (AlSi) as maincomponents for electrode was used and a QCM sensor having a diameter(sensor diameter) of the surface of the quartz oscillator of 14 mm, anelectrode diameter of the surface of the quartz oscillator of 5 mm, anda resonance frequency of 9 MHz was used.

The obtained frequency change was converted to gram based on thespecific value of the quartz oscillator for use in the measurement toclarify the relationship between the sublimate amount from one waferonto which the resist underlayer film was applied and the time elapsed.Here, the initial 60 seconds was a period of time when the apparatus wasleft to stand for stabilizing the apparatus (the wafer was not placed).The measurement value measured at the point of time of 60 seconds to 180seconds after placing the wafer on the hot plate is a measurement valueof the sublimate amount from the wafer. The sublimate amounts of theresist underlayer films quantified with the apparatus are listed inTable 1 as sublimate amount ratios. The upper limit of the sublimateamount is determined to be 2,000 ng. The sublimate amount equal to orless than the upper limit is defined to be good, whereas the amountequal to or more than the upper limit is defined to be poor. Thesublimate amount of 2,000 ng or less is listed as ◯ and the sublimateamount of 2,000 ng or more is listed as X.

TABLE 1 Sublimate amount generated from resist underlayer film Resistunderlayer film Baking temperature Sublimate amount Example 1 240° C. ◯Example 2 240° C. ◯ Example 3 240° C. ◯ Example 4 240° C. ◯ Example 5240° C. ◯ Example 6 240° C. ◯ Example 7 240° C. ◯ Example 8 240° C. ◯Example 9 240° C. ◯ Example 10 240° C. ◯ Example 11 240° C. ◯Comparative Example 1 240° C. X Comparative Example 2 240° C. ◯Comparative Example 3 240° C. ◯ Comparative Example 4 240° C. ◯

(Elution Test to Photoresist Solvent)

Each of the resist underlayer film-forming composition solutionsprepared in Examples 1 to 11 and Comparative Examples 1 to 4 was appliedonto a silicon wafer with a spin coater. The applied solution was bakedon a hot plate at 400° C. for 2 minutes to form a resist underlayer film(film thickness 0.25 The resist underlayer film was immersed intosolvents for use in the resist, for example, ethyl lactate, propyleneglycol monomethyl ether, propylene glycol monomethyl ether acetate, andcyclohexanone. It was confirmed that the resist underlayer film wasinsoluble to these solvents.

(Embeddability Test to Hole Pattern)

Whether the resist underlayer film-forming composition can be embeddedwell in the hole was evaluated. The resist underlayer film-formingsubstance was applied with a spin coater onto a tetraethylorthosilicate(TEOS) substrate in which holes (hole diameter: 0.120 nm, pitch: a ratioof hole diameter/space between holes=1/0.8, hole depth: 400 nm) wereformed. Thereafter, the applied film was heated on the hot plate at 240°C. for 1 minute to form a resist underlayer film (in the case ofapplication of gap fill material for lithography) having a thickness ofabout 120 nm. The embeddability was evaluated by observing the sectionalshapes of the TEOS substrates having holes to which the resistunderlayer film-forming substances obtained in Examples 1 to 11 andComparative Example 1 to 4 were applied using a scanning electronmicroscope (SEM). The case that the resist underlayer film was formed inthe holes without clearance gaps was determined to be good (“◯”),whereas the case that the resist underlayer film was not embedded in theholes or openings or clearance gaps existed in the holes was determinedto be poor (“X”).

TABLE 2 Embeddability of resist underlayer film Resist underlayer filmBaking temperature Embeddability Example 1 240° C. ◯ Example 2 240° C. ◯Example 3 240° C. ◯ Example 4 240° C. ◯ Example 5 240° C. ◯ Example 6240° C. ◯ Example 7 240° C. ◯ Example 8 240° C. ◯ Example 9 240° C. ◯Example 10 240° C. ◯ Example 11 240° C. ◯ Comparative Example 1 240° C.◯ Comparative Example 2 240° C. X Comparative Example 3 240° C. XComparative Example 4 240° C. X

INDUSTRIAL APPLICABILITY

Different from conventional materials having difficulty in satisfyingboth reduction in sublimate generation and embeddability in the holepattern, the resist underlayer film-forming composition using thecrosslinking agent of the present invention and for use in lithographyprocesses can provide the resist underlayer film capable of having bothproperties.

The invention claimed is:
 1. A resist underlayer film obtained byapplying a resist underlayer film-forming composition onto asemiconductor substrate and baking the applied resist underlayerfilm-forming composition, the resist underlayer film-forming compositioncomprising: a resin; and a crosslinkable compound of Formula (1) orFormula (2):

wherein Q¹ is a single bond or an m1-valent organic group; R¹ and R⁴ areeach a C₂₋₁₀ alkyl group having a C₁₋₁₀ alkoxy group; R² and R⁵ are eacha hydrogen atom or a methyl group; R³ and R⁶ are each a C₁₋₁₀ alkylgroup or a C₆₋₄₀ aryl group; n1 is an integer of 1≤n1≤3; n2 is aninteger of 2 n2≤5; n3 is an integer of 0≤n3≤3; n4 is an integer of0≤n4≤3; a total of the integers is an integer of 3≤(n1+n2+n3+n4)≤6; andn5 is an integer of 1≤n5≤3; n6 is an integer of 1≤n6≤4; n7 is an integerof 0≤n7≤3; n8 is an integer of 0≤n8≤3; a total of the integers is aninteger of 2≤(n5+n6+n7+n8)≤5; and m1 is an integer of 2 to
 10. 2. Amethod for forming a resist pattern for use in semiconductor production,the method comprising: applying a resist underlayer film-formingcomposition onto a semiconductor substrate, and baking the appliedresist underlayer film forming composition to form a resist underlayerfilm, the resist underlayer film-forming composition comprising: aresin; and a crosslinkable compound of Formula (1) or Formula (2):

wherein Q¹ is a single bond or an m1-valent organic group; R¹ and R⁴ areeach a C₂₋₁₀ alkyl group having a C₁₋₁₀ alkoxy group; R² and R⁵ are eacha hydrogen atom or a methyl group; R³ and R⁶ are each a C₁₋₁₀ alkylgroup or a C₆₋₄₀ aryl group; n1 is an integer of 1≤n1≤3; n2 is aninteger of 2 n2≤5; n3 is an integer of 0≤n3≤3; n4 is an integer of0≤n4≤3; a total of the integers is an integer of 3≤(n1+n2+n3+n4)≤6; andn5 is an integer of 1≤n5≤3; n6 is an integer of 1≤n6≤4; n7 is an integerof 0≤n7≤3; n8 is an integer of 0≤n8≤3; a total of the integers is aninteger of 2≤(n5+n6+n7+n8)≤5; and m1 is an integer of 2 to
 10. 3. Amethod for producing a semiconductor device, the method comprising:forming a resist underlayer film by applying a resist underlayerfilm-forming composition onto a semiconductor substrate, the resistunderlayer film-forming composition comprising: a resin; and acrosslinkable compound of Formula (1) or Formula (2):

wherein Q¹ is a single bond or an m1-valent organic group; R¹ and R⁴ areeach a C₂₋₁₀ alkyl group having a C₁₋₁₀ alkoxy group; R² and R⁵ are eacha hydrogen atom or a methyl group; R³ and R⁶ are each a C₁₋₁₀ alkylgroup or a C₆₋₄₀ aryl group; n1 is an integer of 1≤n1≤3; n2 is aninteger of 2 n2≤5; n3 is an integer of 0≤n3≤3; n4 is an integer of0≤n4≤3; a total of the integers is an integer of 3≤(n1+n2+n3+n4)≤6; andn5 is an integer of 1≤n5≤3; n6 is an integer of 1≤n6≤4; n7 is an integerof 0≤n7≤3; n8 is an integer of 0≤n8≤3; a total of the integers is aninteger of 2≤(n5+n6+n7+n8)≤5; and m1 is an integer of 2 to 10; forming aresist film on the resist underlayer film; forming a resist pattern byirradiation with light or electron beams and development; etching theresist underlayer film by using the formed resist pattern; andprocessing the semiconductor substrate by using the patterned resistunderlayer film.
 4. A method for producing a semiconductor device, themethod comprising: forming a resist underlayer film by applying a resistunderlayer film-forming composition onto a semiconductor substrate, theresist underlayer film-forming composition comprising: a resin; and acrosslinkable compound of Formula (1) or Formula (2):

wherein Q¹ is a single bond or an m1-valent organic group; R¹ and R⁴ areeach a C₂₋₁₀ alkyl group having a C₁₋₁₀ alkoxy group; R² and R⁵ are eacha hydrogen atom or a methyl group; R³ and R⁶ are each a C₁₋₁₀ alkylgroup or a C₆₋₄₀ aryl group; n1 is an integer of 1≤n1≤3; n2 is aninteger of 2 n2≤5; n3 is an integer of 0≤n3≤3; n4 is an integer of0≤n4≤3; a total of the integers is an integer of 3≤(n1+n2+n3+n4)≤6; andn5 is an integer of 1≤n5≤3; n6 is an integer of 1≤n6≤4; n7 is an integerof 0≤n7≤3; n8 is an integer of 0≤n8≤3; a total of the integers is aninteger of 2≤(n5+n6+n7+n8)≤5; and m1 is an integer of 2 to 10; forming ahard mask on the resist underlayer film; forming a resist film on thehard mask; forming a resist pattern by irradiation with light orelectron beams and development; etching the hard mask by using theformed resist pattern; etching the resist underlayer film by using thepatterned hard mask; and processing the semiconductor substrate by usingthe patterned resist underlayer film.
 5. The method according to claim4, wherein the hard mask is formed by application of an inorganicsubstance or vapor-deposition of an inorganic substance.
 6. A compoundof Formula (5):

wherein Q³ is an isopropylidene group; R¹⁴ is a C₂₋₁₀ alkyl group havinga C₁₋₁₀ alkoxy group; R¹⁵ is a hydrogen atom or a methyl group; R¹³ is aC₁₋₁₀ alkyl group or a C₆₋₄₀ aryl group; n17 is an integer of 1≤n17≤3;n18 is an integer of 1≤n18≤4; n19 is an integer of 0≤n19≤3; n20 is aninteger of 0≤n20≤3; and a total of the integers is an integer of2≤(n17+n18+n19+n20)≤5.
 7. A composition comprising at least one of acompound of Formula 3-33, Formula 3-34, Formula 3-35, or Formula 3-36:


8. The composition according to claim 7, where in the compositioncomprises a compound of Formula 3-33.
 9. The composition according toclaim 7, where in the composition comprises a compound of Formula 3-34.10. The composition according to claim 7, where in the compositioncomprises a compound of Formula 3-35.
 11. The composition according toclaim 7, where in the composition comprises a compound of Formula 3-36.12. The composition according to claim 7, where in the compositioncomprises a compound of Formula 3-33, Formula 3-34, Formula 3-35, andFormula 3-36.